COF (Chip on Flex): Display Packaging Technology

COF (Chip on Flex) is a display packaging technology, where a chip is mounted directly to a flex circuit. Also refer to COG and COP.

COF technology, short for chip on film, is widely used in small and medium-sized displays.

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Flexible Printed Circuit For Today's Packaging - JHYPCB

PDF) Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Global Chip On Flex COF Market Size was estimated at USD 1716.19 million in 2021 and is projected to reach USD 2349.61 million by 2028, by Organicmarket Research Business Consulting

COF VS COG - What is the difference? : r/mobilephonerepair

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) - ScienceDirect

COF chip on flex cable change, new technology

LG Innotek launched the world's thinnest semiconductor package substrate - IBE Electronics

PDF) Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability

COF LCD and TAB Module Manufacturer - Palmtech

Driver IC Packaging & Assembly for Flexible Displays

What is the difference between COF, COG in Mobile LCD Screen? - News - SCRC TECH CO., LTD